Lapping is a process that removes the surface Silicon which has been cracked or otherwise damaged by the Slicing process and assures a flat surface. All polished substrates (including profiled ones) are then etched in a chemically active reagent to remove any crystal damage remaining from the previous process step. The next step is polishing which is also performed in-house by Cimcoop.
- Surface quality 20-10
- Surface roughness up to 5 angstroms
- Flatness: λ/6 at 633 nm
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